B5116ECMDXGJD-U DRAM Chip DDR3L SDRAM 8Gbit 512M x 16 1.35V 96-Pin FBGA IC

• Customization: Available
• Conductive Type: Bipolar Integrated Circuit
• Integration: MSI
• Model NO.: B5116ECMDXGJD-U
• Technics: Semiconductor IC
• MFG.: KINGSTON
• D/C: 22
• Package: FBGA
• Quality: Genuine New Original
• shape: hqfp64
• Transport Package: Box
• Origin: China
• HS Code: 8542390000
• Production Capacity: 1000000PCS

Product Description

Description

B5116ECMDXGJD-U : 8G bits DDR3L SDRAM 512 M words x 16 bits) 96-ball FBGA

Mfr. Part#: B5116ECMDXGJD-U

Mfr.: KINGSTON

Datasheet: (e-mail or chat us for PDF file)

ROHS Status: 

Quality: 100% Original

Warranty: ONE YEAR
 

	Description	Value
	Address Bus Width	16 Bit
	Data Bus Width	16 Bit
	Density	8 Gbit
	Maximum Clock Rate	933 MHz
	Maximum Operating Current	125 mA
	Maximum Random Access Time	20 ns
	Number of Banks	8
	Number of Bits per Word	16 Bit
	Number of I/O Lines	16 Bit
	Operating Supply Voltage	2.6, 4.8 V
	Operating Temperature	-40 to 85 °C
	Organization	512M x 16
	Pin Count	96
	Product Dimensions	9 x 13.5 x 0.85 mm
	Screening Level	Industrial
	Supplier Package	FBGA
	Type	DDR3L SDRAM

 

B5116ECMDXGJD

8Gb 96 ball FBGA DDR3/3L

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
9x13.5x1.2	512Mx16	1866 Mbps	1.35V^1	0°C ~ +95°C

 

Specifications
• Density: 8G bits
• Organization 64Mwords x 16bits x 8banks
• Package 96-ball FBGA Lead-free (RoHS compliant) and Halogen-free
• Power supply: 1.35V (Typ) VDD, VDDQ = 1.283V to 1.45V Backward compatible for VDD, VDDQ=1.5V 0.075V
• Data rate 1866Mbps / 1600Mbps (max.)
• 2KB page size Row address: A0 to A15 Column address: A0 to A9
• Eight internal banks for concurrent operation
• Burst lengths (BL): 8 and 4 with Burst Chop (BC)
• Burst type (BT): Sequential (8, 4 with BC) Interleave (8, 4 with BC)
• Programmable /CAS (Read) Latency (CL)
• Programmable /CAS Write Latency (CWL)
• Precharge: auto precharge option for each burst access
• Driver strength: RZQ/7, RZQ/6 (RZQ = 240Ω)
• Refresh: auto-refresh, self-refresh


Features
• Double-data-rate architecture: two data transfers per clock cycle
• The high-speed data transfer is realized by the 8 bits prefetch pipelined architecture
• Bi-directional differential data strobe (DQS and /DQS) is transmitted/received with data for capturing data at the receiver
• DQS is edge-aligned with data for READs; centeraligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DQS transitions with CK transitions
• Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
• Data mask (DM) for write data
• Posted /CAS by programmable additive latency for better command and data bus efficiency
• On-Die Termination (ODT) for better signal quality Synchronous ODT Dynamic ODT Asynchronous ODT
• Multi Purpose Register (MPR) for pre-defined pattern read out
• ZQ calibration for DQ drive and ODT
• Automatic self refresh (ASR)
• /RESET pin for Power-up sequence and reset function
• SRT range: Normal/extended
• Programmable Output driver impedance contro




 

Standard Part Numbers and Specifications

D1216ECMDXGJD

2Gb 96 ball FBGA DDR3/3L

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13.5x1.2	128Mx16	1866 Mbps	1.35V	0°C ~ +95°C

D2568ECMDPGJD

2Gb 78 ball FBGA DDR3/3L

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x10.6x1.2	256Mx8	1866 Mbps	1.35V	0°C ~ +95°C

D2516ECMDXGJD

4Gb 96 ball FBGA DDR3/3L

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13.5x1.2	256Mx16	1866 Mbps	1.35V^1	0°C ~ +95°C

D5128ECMDPGJD

4Gb 78 ball FBGA DDR3/3L

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x10.6x1.2	512Mx8	1866 Mbps	1.35V^1	0°C ~ +95°C

D2516ECMDXGME

4Gb 96 ball FBGA DDR3/3L

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13.5x1.2	256Mx16	2133 Mbps	1.35V^1	0°C ~ +95°C

B5116ECMDXGJD

8Gb 96 ball FBGA DDR3/3L

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
9x13.5x1.2	512Mx16	1866 Mbps	1.35V^1	0°C ~ +95°C

D1216ECMDXGJDI

2Gb 96 ball FBGA DDR3/3L I-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13.5x1.2	128Mx16	1866 Mbps	1.35V	-40°C ~ +95°C

D2568ECMDPGJDI

2Gb 78 ball FBGA DDR3/3L I-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x10.6x1.2	256Mx8	1866 Mbps	1.35V	-40°C ~ +95°C

D2516ECMDXGJDI

4Gb 96 ball FBGA DDR3/3L I-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13.5x1.2	256Mx16	1866 Mbps	1.35V^1	-40°C ~ +95°C

D5128ECMDPGJDI

4Gb 78 ball FBGA DDR3/3L I-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x10.6x1.2	512Mx8	1866 Mbps	1.35V^1	-40°C ~ +95°C

D2516ECMDXGMEI

4Gb 96 ball FBGA DDR3/3L I-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13.5x1.2	256Mx16	2133 Mbps	1.35V^1	-40°C ~ +95°C

B5116ECMDXGJDI

8Gb 96 ball FBGA DDR3/3L I-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
9x13.5x1.2	512Mx16	1866 Mbps	1.35V^1	-40°C ~ +95°C

D5116AN9CXGRK

8Gb 96 ball FBGA DDR4 C-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13x1.2	512Mx16	2666 Mbps	1.2V	0°C ~ +95°C

D5116AN9CXGXN

8Gb 96 ball FBGA DDR4 C-Temp

Package	Configuration	Speed Mbps	VDD, VDDQ	Operating Temperature
7.5x13.5x1.2	512Mx16	3200 Mbps	1.2V	0°C ~ +95°C

 

 

 

Why choosing us

• Located in Shenzhen, the electronic market center of China.
• 100% guarantee components quality: Genuine Original.
• Sufficient stock on your urgent demand.
• Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
• Faster shipment: In stock components can ship the same day .
• 24 Hours service 

 

Notice:

1. Product images are for reference only.
2. You can contact sales person to apply for a better price.
3.  For more products, Pls do not hesitate to contact our Sales team.