IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC

Product Details
Customization: Available
Conductive Type: Bipolar Integrated Circuit
Integration: MSI
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Number of Employees
3
Year of Establishment
2018-08-13
  • IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC
  • IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC
  • IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC
  • IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC
  • IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC
  • IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC
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Basic Info.

Model NO.
IRF7341TRPBF
Technics
Semiconductor IC
MFG.
INFINEON
D/C
22+
Package
SOIC8
Quality
Genuine New Original
shape
hqfp64
Transport Package
Box
Origin
China
HS Code
8542399000
Production Capacity
1000000PCS

Product Description

Description

IRF7341TRPBF: Mosfet Array 55V 4.7A 2W Surface Mount 8-SO

Mfr. Part#: IRF7341TRPBF

Mfr.: INFINEON

Datasheet: IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC(e-mail or chat us for PDF file)

ROHS Status: IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC

Quality: 100% Original

Warranty: ONE YEAR


 

Product Status
Active
 
Technology
MOSFET (Metal Oxide)
 
Configuration
2 N-Channel (Dual)
 
FET Feature
Logic Level Gate
 
Drain to Source Voltage (Vdss)
55V
 
Current - Continuous Drain (Id) @ 25°C
4.7A
 
Rds On (Max) @ Id, Vgs
50mOhm @ 4.7A, 10V
 
Vgs(th) (Max) @ Id
1V @ 250µA
 
Gate Charge (Qg) (Max) @ Vgs
36nC @ 10V
 
Input Capacitance (Ciss) (Max) @ Vds
740pF @ 25V
 
Power - Max
2W
 
Operating Temperature
-55°C ~ 150°C (TJ)
 
Mounting Type
Surface Mount
 
Package / Case
8-SOIC (0.154", 3.90mm Width)
 
Supplier Device Package
8-SO
 
Base Product Number
IRF734



Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application











IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC


IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC


IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC

IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC

IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC

IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC
IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC

IRF7341TRPBF MOSFET 2N-CH 55V 4.7A 8-SOIC



 

Why choosing us

  • Located in Shenzhen, the electronic market center of China.
  • 100% guarantee components quality: Genuine Original.
  • Sufficient stock on your urgent demand.
  • Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
  • Faster shipment: In stock components can ship the same day .
  • 24 Hours service 

 

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