K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12

Product Details
Customization: Available
Conductive Type: Bipolar Integrated Circuit
Integration: GSI
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Number of Employees
3
Year of Establishment
2018-08-13
  • K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12
  • K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12
  • K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12
  • K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12
  • K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12
  • K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12
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Basic Info.

Model NO.
K4Z80325BC-HC14
Operating Temperature
-55℃ - 125℃
Shape
Flat
Technics
Semiconductor IC
MFR.
SAMS
D/C
23+
Package
BGA
Quality
Genuine New Original
Product status
Active
Transport Package
Box
Specification
integrated circuit
Origin
China
HS Code
8542399000
Production Capacity
1000000PCS

Packaging & Delivery

Package Size
20.00cm * 20.00cm * 5.00cm
Package Gross Weight
0.500kg

Product Description

description

K4Z80325BC-HC14 8Gbit SGRAM GDDR6 2250MHz FBGA-180 DDR SDRAM 

Mfr. Part#: K4Z80325BC-HC14

Datasheet: K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12(e-mail or chat us for PDF file)

ROHS Status: K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12

Quality: 100% Original

Warranty: ONE YEAR
 

 
 
 
Category Memory/DDR SDRAM
Package FBGA-180
Current - Supply -
Refresh Current -
Memory Size 8Gbit
Voltage - Supply -
Memory Format SGRAM GDDR6
Clock Frequency 2250MHz
Operating Temperature 0ºC~+95ºC
 

The GDDR6 SGRAM is a high-speed dynamic random-access memory designed for applications requiring high bandwidth. GDDR6 devices contain the following number of bits: 8Gb has 8,589,934,592 bits 12Gb has 12,884,901,888 bits 16Gb has 17,179,869,184 bits 24Gb has 25,769,803,776 bits 32Gb has 34,359,738,368 bits The GDDR6 SGRAM's high-speed interface is optimized for point-to-point connections to a host controller. On-die termination (ODT) is provided for all high-speed interface signals to eliminate the need for termination resistors in the system. GDDR6 uses a 16n prefetch architecture and a DDR interface to achieve high-speed operation. The device's architecture consists of two 16 bit wide fully independent channels. GDDR6 operates from a differential clock CK_t and CK_c. CK is common to both channels. Command and Address (CA) are registered at every rising edge of CK and every falling edge of CK. There are both single cycle and multi cycle commands. See command truth table for details. GDDR6 uses a free running differential forwarded clock (WCK_t/WCK_c) with both input and output data registered and driven respectively at both edges of the forwarded WCK. See Clocking section for details. Read and write accesses to GDDR6 are burst oriented; accesses start at a selected location and consists of a total of sixteen data words. Accesses begin with the registration of an Activate command, which is then followed by a Read, Write (WOM) or masked Write (WDM, WSM) command. The row and bank address to be accessed is registered coincident with the Activate command. The address bits registered coincident with the Read, Write or masked Write command are used to select the bank and the starting column location for the burst access. This specification includes all features and functionality required for GDDR6 SGRAM devices. In many cases the GDDR6 specification describes the behavior of a single channel.




 

 



K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12


K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12

K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12







 



K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12


K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12
 


K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12

K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12


Certificates

K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12

K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12



Product Packing details

K4Z80325BC-HC14 8Gbit Synchronous DRAM GDDR6 SGRAM memory ic chip K4Z80325BC K4Z80325BC-HC18 K4Z80325BC-HC16 K4Z80325BC-HC12

Why choosing us

  • Located in Shenzhen, the electronic market center of China.
  • 100% guarantee components quality: Genuine Original.
  • Sufficient stock on your urgent demand.
  • Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
  • Faster shipment: In stock components can ship the same day .
  • 24 Hours service 

 

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