Description
XC7K325T-2FFG900I: IC FPGA 500 I/O 900FCBGA
Package: FPGA
Mfr. Part#: XC7K325T-2FFG900I
Mfr.: XILINX
Datasheet: 
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ROHS Status:
Quality: 100% Original
Warranty: 180 days
Xilinx 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Kintex-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
- Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
- 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
- High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
- High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
- A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
- DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
- Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
- Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
- Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
- Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
- Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
| Part Status |
Active |
| Number of LABs/CLBs |
25475 |
| Number of Logic Elements/Cells |
326080 |
| Total RAM Bits |
16404480 |
| Number of I/O |
500 |
| Voltage - Supply |
0.97V ~ 1.03V |
| Mounting Type |
Surface Mount |
| Operating Temperature |
-40°C ~ 100°C (TJ) |
| Package / Case |
900-BBGA, FCBGA |
| Supplier Device Package |
900-FCBGA (31x31) |
Company Product Line
Certificates
Why choosing us
- Located in Shenzhen, the electronic market center of China.
- 100% guarantee components quality: Genuine Original.
- Sufficient stock on your urgent demand.
- Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
- Faster shipment: In stock components can ship the same day .
- 24 Hours service
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