INTEGRATED CIRCUITS OMAPL138EZWTD4 SOC OMAPL1xx ARM926EJ-S

• shape: SMD
• Conductive Type: Unipolar Integrated Circuit
• Integration: LSI
• Technics: Thick Film IC
• Application: Standard Generalized Integrated Circuit
• Type: Digital / Analog IC
• Model NO.: OMAPL138EZWTD4
• MFG.: TI
• D/C: 17+
• Package: BGA-361
• Quality: Genuine New Original
• Transport Package: Box
• Origin: China
• HS Code: 8542390000
• Production Capacity: 1000000PCS

Product Description

Description

OMAPL138EZWTD4: DSP Fixed-Point/Floating-Point 32-Bit 456MHz 3648MIPS 361-Pin NFBGA  

Package: BGA-361

Mfr. Part#: OMAPL138EZWTD4

Mfr.: TI

Datasheet: (e-mail or chat us for PDF file)

ROHS Status: 

Quality: 100% Original

Warranty: 180 days
 

Product Status	Active
Core Processor	ARM926EJ-S
Number of Cores/Bus Width	1 Core, 32-Bit
Speed	456MHz
Co-Processors/DSP	Signal Processing; C674x, System Control; CP15
RAM Controllers	SDRAM
Graphics Acceleration	No
Display & Interface Controllers	LCD
Ethernet	10/100Mbps (1)
SATA	SATA 3Gbps (1)
USB	USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O	1.8V, 3.3V
Operating Temperature	-40°C ~ 90°C (TJ)
Security Features	Boot Security, Cryptography
Mounting Type	Surface Mount
Package / Case	361-LFBGA
Supplier Device Package	361-NFBGA (16x16)
Additional Interfaces	HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART
Base Product Number	OMAPL138

 

The OMAP-L138 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000 platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a 32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

For security-enabled devices, TI's Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based "root-of-trust", the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects the users' IP and lets them securely set up the system and begin device operation with known, trusted code.

 

Key Features

• Dual-Core SoC
  • 375- and 456-MHz ARM926EJ-S RISC MPU
  • 375- and 456-MHz C674x Fixed- and Floating-Point VLIW DSP
• ARM926EJ-S Core
  • 32- and 16-Bit (Thumb) Instructions
  • DSP Instruction Extensions
  • Single-Cycle MAC
  • ARM Jazelle Technology
  • Embedded ICE-RT for Real-Time Debug
• ARM9 Memory Architecture
  • 16KB of Instruction Cache
  • 16KB of Data Cache
  • 8KB of RAM (Vector Table)
  • 64KB of ROM
• C674x Instruction Set Features
  • Superset of the C67x+ and C64x+ ISAs
  • Up to 3648 MIPS and 2746 MFLOPS
  • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
  • 8-Bit Overflow Protection
  • Bit-Field Extract, Set, Clear
  • Normalization, Saturation, Bit-Counting
  • Compact 16-Bit Instructions
• C674x Two-Level Cache Memory Architecture
  • 32KB of L1P Program RAM/Cache
  • 32KB of L1D Data RAM/Cache
  • 256KB of L2 Unified Mapped RAM/Cache
  • Flexible RAM/Cache Partition (L1 and L2)
• Enhanced Direct Memory Access Controller 3 (EDMA3):
  • 2 Channel Controllers
  • 3 Transfer Controllers
  • 64 Independent DMA Channels
  • 16 Quick DMA Channels
  • Programmable Transfer Burst Size
• TMS320C674x Floating-Point VLIW DSP Core
  • Load-Store Architecture with Nonaligned Support
  • 64 General-Purpose Registers (32-Bit)
  • Six ALU (32- and 40-Bit) Functional Units
    • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
    • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
    • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
  • Two Multiply Functional Units:
    • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
      • 2 SP x SP → SP Per Clock
      • 2 SP x SP → DP Every Two Clocks
      • 2 SP x DP → DP Every Three Clocks
      • 2 DP x DP → DP Every Four Clocks
    • Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
  • Instruction Packing Reduces Code Size
  • All Instructions Conditional
  • Hardware Support for Modulo Loop Operation
  • Protected Mode Operation
  • Exceptions Support for Error Detection and Program Redirection
• Software Support
  • TI DSPBIOS
  • Chip Support Library and DSP Library
• 128KB of RAM Shared Memory
• 1.8-V or 3.3-V LVCMOS I/Os (Exceptfor USB and DDR2 Interfaces)
• Two External Memory Interfaces:
  • EMIFA
    • NOR (8- or 16-Bit-Wide Data)
    • NAND (8- or 16-Bit-Wide Data)
    • 16-Bit SDRAM with 128-MB Address Space
  • DDR2/Mobile DDR Memory Controller with one of the following:
    • 16-Bit DDR2 SDRAM with 256-MB Address Space
    • 16-Bit mDDR SDRAM with 256-MB Address Space

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• Located in Shenzhen, the electronic market center of China.
• 100% guarantee components quality: Genuine Original.
• Sufficient stock on your urgent demand.
• Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
• Faster shipment: In stock components can ship the same day .
• 24 Hours service 

 

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