• LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC
  • LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC
  • LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC
  • LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC
  • LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC
  • LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC

LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC

shape: SMD
Conductive Type: Bipolar Integrated Circuit
Integration: MSI
Technics: Semiconductor IC
Application: Standard Generalized Integrated Circuit
Type: Digital / Analog IC
Samples:
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Basic Info.

Model NO.
LPC1768FBD100
MFG.
NXP
D/C
19+
Package
LQFP-100
Quality
Genuine New Original
Transport Package
Box
Origin
China
HS Code
8542390000
Production Capacity
1000000PCS

Product Description

Description

LPC1768FBD100: MCU 32-Bit LPC1768 ARM Cortex M3 RISC 512KB Flash 2.4V to 3.6V 100-Pin LQFP Tray

Package: LQFP100

Mfr. Part#: LPC1768FBD100

Mfr.: GENESYS

Datasheet: LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC(e-mail or chat us for PDF file)

ROHS Status: LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC

Quality: 100% Original

Warranty: 180 days

 
Part Status Active  
Core Processor ARM® Cortex®-M3  
Core Size 32-Bit  
Speed 100MHz  
Connectivity CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG  
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT  
Number of I/O 70  
Program Memory Size 512KB (512K x 8)  
Program Memory Type FLASH  
EEPROM Size -  
RAM Size 64K x 8  
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V  
Data Converters A/D 8x12b; D/A 1x10b  
Oscillator Type Internal  
Operating Temperature -40°C ~ 85°C (TA)  
Mounting Type Surface Mount  
Package / Case 100-LQFP  
Supplier Device Package 100-LQFP (14x14)
The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The ARM Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration. The LPC1768/67/66/65/64/63 operate at CPU frequencies of up to 100 MHz. The LPC1769 operates at CPU frequencies of up to 120 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching. The peripheral complement of the LPC1769/68/67/66/65/64/63 includes up to 512 kB of flash memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface, 8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers, SPI interface, 3 I2C-bus interfaces, 2-input plus 2-output I2S-bus interface, 8-channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, four general purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock (RTC) with separate battery supply, and up to 70 general purpose I/O pins.

Key Features

  • ARM Cortex-M3 processor, running at frequencies of up to 100 MHz (LPC1768/67/66/65/64/63) or of up to 120 MHz (LPC1769). A Memory Protection Unit (MPU) supporting eight regions is included.
  • ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
  • Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator enables high-speed 120 MHz operation with zero wait states.
  • In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.
  • On-chip SRAM includes:
    • 32/16 kB of SRAM on the CPU with local code/data bus for high-performance CPU access.
    • Two/one 16 kB SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as for general purpose CPU instruction and data storage.
  • Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with SSP, I2S-bus, UART, Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers.
  • Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and the USB interface. This interconnect provides communication with no arbitration delays.
 
 

Company Product Line


LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC







 


LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC


LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC

LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC


LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC

LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC


Certificates

LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC

Product Packing details

LPC1768FBD100 MCU 32-bit ARM Cortex M3 RISC 512KB Flash IC

Why choosing us

  • Located in Shenzhen, the electronic market center of China.
  • 100% guarantee components quality: Genuine Original.
  • Sufficient stock on your urgent demand.
  • Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
  • Faster shipment: In stock components can ship the same day .
  • 24 Hours service 

 

Notice:

  1. Product images are for reference only.
  2. You can contact sales person to apply for a better price.
  3.  For more products, Pls do not hesitate to contact our Sales team. 

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Registered Capital
100000 RMB
Plant Area
<100 square meters