Customization: | Available |
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Conductive Type: | Bipolar Integrated Circuit |
Integration: | MSI |
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TPS61230ARNSR : Boost Switching Regulator IC Positive Adjustable 2.5V 1 Output 6A (Switch) 7-VFQFN
Package: VQFN-7
Mfr. Part#: TPS61230ARNSR
Mfr.: TI
Datasheet:
(e-mail or chat us for PDF file)
ROHS Status:
Quality: 100% Original
Warranty: 180 days
Part Status | Active | |
---|---|---|
Function | Step-Up | |
Output Configuration | Positive | |
Topology | Boost | |
Output Type | Adjustable | |
Number of Outputs | 1 | |
Voltage - Input (Min) | 2.5V | |
Voltage - Input (Max) | 4.5V | |
Voltage - Output (Min/Fixed) | 2.5V | |
Voltage - Output (Max) | 5.5V | |
Current - Output | 6A (Switch) | |
Frequency - Switching | 1.15MHz | |
Synchronous Rectifier | Yes | |
Operating Temperature | -40°C ~ 125°C (TJ) | |
Mounting Type | Surface Mount | |
Package / Case | 7-VFQFN | |
Supplier Device Package | 7-VQFN-HR (2x2) |
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The TPS61230A device is a high efficiency fully integrated synchronous boost converter.It integrates 6-A, 21-mΩ and 18-mΩ power switches, which is capable of delivering up to 2.4-Aoutput current at 5-V output with the 2.5-V input supply. The low RDS_ONswitches enable the power conversion efficiency up to 96% and minimize the thermal stress in verycompact solution size.
The typical operating frequency is 1.15 MHz, which allows the use of small inductor andcapacitors to achieve a small solution size. The TPS61230A provides an adjustable output voltagevia an external resistor divider.
During the light load condition, the TPS61230A automatically enters into the PFMoperation for maximizing the efficiency with the lowest quiescent current. In the shutdown bypulling EN pin to the logic low, the load is completely disconnected from the input, and the inputcurrent consumption is reduced to below 1.0 µA.
When the output is shorted, the device enters into the hiccup protection mode andrecovery automatically when the output short is released. Other features like the output overvoltage protection, thermal shutdown protection are integrated.
The device is available in a 2.00-mm x 2.00-mm x 0.9-mm VQFN package and requires theminimum amount of external components.
Notice: